Solder Material Market Forecast Report | Global Analysis, Statistics, Revenue, Demand and Trend Analysis Research Report by 2027

 

Solder Material Market Forecast to Reach USD 1.49 Billion by 2027

The augmenting demand for these materials in the electrical & electronics, and construction industries is a crucial factor driving the market growth.

Market Size – USD 1.15 Billion in 2019, Market Growth - CAGR of 3.5%, Market Trends – The rising demand for smart electronic devices and gadgets

The Global Solder Material Market is expected to be valued at USD 1.49 Billion in 2027 from USD 1.15 Billion in 2019, registering a CAGR of 3.5% through the forecast period. Solder is a fusible metal alloy (generally composed of lead and tin) that is melted using a hot iron to join or amalgamate different pieces of metal together. The solder is melted at the beginning to connect the metal pieces, and after it cools down, it creates a permanent electrical bond between these pieces. During the process of soldering, the iron is heated above 600° Fahrenheit. However, owing to the toxic nature of lead, governments worldwide are increasingly focusing on replacing conventional solder with lead-free solder. Solder materials with a low lead content are somewhat environmentally compatible and are not banned by regulatory bodies. Lead-free solders – which comprise tin, silver, copper, bismuth, zinc, indium, antimony, and slight traces of other metals –have a wide range of commercial applications.

The global solder material market has gained significant traction over recent years due to various favorable factors. Increasing usage of solders in the manufacture of advanced consumer electronic products, growing need for repairing and refurbishing electronic gadgets such as smartphones and computers, rising adoption of new semiconductor technologies, and the emergence of lead-free solders due to rigid government norms are the pivotal factors accountable for the growth of the global solder material market. Technological advancements, such as automation in soldering processes, make them more efficient and hence, create further prospects for market growth in the near future. Furthermore, the growing industrial applications of solders comprising nano-paste and sub-micron particles due to their excellent properties, such as large surface energy, super magnetism, and low melting point temperatures, boost the global market growth. 

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Key findings of the report:

·       Based on the process, the wave/reflow sub-segment emerged as the leading market segment in 2019, with a revenue share of USD 0.45 billion. The wave/reflow process is one of the soldering techniques most widely used in the electrical & electronics sector, which is a key factor for this segment’s growth.

·       Among the key regional markets, the Asia Pacific region is touted as the leading market for solder materials. The market is projected to grow significantly in the upcoming years, registering a CAGR of 5%. Fast-paced industrialization and urbanization, especially in developing countries like India and China, the exponentially growing manufacturing sector, the expanding electrical and electronics, and the increasing usage in the automotive and construction industries, are the factors indispensable to the market growth in this region.

·       Leading market players include Tamura Corporation, Fusion, Inc., Kester, Indium Corporation, Lucas Milhaupt, Inc., Senju Metal Industry Co., Ltd., Qualitek International, Inc., Nihon Genma, Koki Company ltd., and Stannol GmbH & Co. KG.

·       In May 2020, Heraeus Electronics, a leading provider of electronics packaging material solutions, unveiled its next-generation aluminum-coated copper wire, called CucorAl Plus. The new product offers high-performance mechanical and electrical properties and enhanced processability.

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For the purpose of this report, the global solder material market has been segmented on the basis of product type, process, application, and region:

By Product Type (Revenue, USD Billion; 2017-2027)

• Wire
• Bar
• Paste
• Flux

By Process (Revenue, USD Billion; 2017-2027)

• Wave/Reflow
• Screen Printing
• Laser
• Robotic

By Application (Revenue, USD Billion; 2017-2027)

• Electrical & Electronics
• Buildings & Construction
• Automotive
• Industrial Machinery & Equipment
• Shipbuilding
• Others

By Region (Revenue, USD Billion; 2017-2027)

o   North America

•                  U.S.

•                  Canada

o   Europe

•                  Germany

•                  U.K.

•                  France

•                  BENELUX

•                  Rest of Europe

o   Asia Pacific

•                  China

•                  Japan

•                  South Korea

•                  Rest of Asia Pacific

o   Latin America

•                  Brazil

•                  Rest of Latin America

o   Middle East & Africa

•                  Saudi Arabia

•                  U.A.E.

•                  Rest of Middle East & Africa

Table Of Content

Chapter 1. Market Synopsis

    1.1. Market Definition

    1.2. Research Scope & Premise

    1.3. Methodology

    1.4. Market Estimation Technique

Chapter 2. Executive Summary

    2.1. Summary Snapshot, 2019-2027

Chapter 3. Indicative Metrics

Chapter 4. Solder Materials Market Segmentation & Impact Analysis

    4.1. Solder Materials Market Product Segmentation Analysis

    4.2. Industrial Outlook

          4.2.1. Market indicators analysis

          4.2.2. Market drivers analysis

Continue …

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